Semiconductor module

ABSTRACT

A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q 1,  Q 2,  and Q 3  are arranged in a direction along which the first side B 1  extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B 1  of the substrate B, and wherein the fourth to the sixth control signal terminals Q 4,  Q 5,  and Q 6  are arranged in a direction along which the second side B 2  extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B 2  of the substrate B.

TECHNICAL FIELD

The present invention relates to semiconductor modules.

BACKGROUND ART

A semiconductor module that converts DC power inputted from a DC powersupply to AC power has conventionally been known as one kind ofsemiconductor devices.

Such a semiconductor module is used to convert a DC voltage to athree-phase AC voltage to drive a three-phase motor, for example (JP6062565 B).

In the conventional semiconductor module (FIGS. 3 and 4), signal linesof both the high side and the low side are disposed on one side (powersupply side or ground side) of the package of the semiconductor module.

Therefore, the gate wiring lines from the low side become long. In theexample of FIG. 3, two bonding wires are needed for one signal line.

Since the wiring for gate control signals differs between the switches(MOS transistors) of the high side and the switches (MOS transistors) ofthe low side, the time required for conveying signals to the high sidediffers from the time required for the low side. This causes a problemin that the switch controllability may be degraded.

DISCLOSURE OF THE INVENTION Problem to be Solved by the Invention

Under the circumstance, it is an object of the present invention todispose the signal lines for controlling the switches of the high sideand the signal lines for controlling the switches of the low side todifferent locations so that the signal lines for conveying the controlsignals for controlling the switches may have the same length and havethe same signal transmission time, thereby improving the switchcontrollability.

Solution to Problem

A semiconductor module according to an embodiment in an aspect of thepresent invention is a semiconductor module configured to convert adirect current to a three-phase alternating current, and to supply thethree-phase alternating current to a three-phase motor to drive thethree-phase motor, the semiconductor module comprising:

-   -   a substrate;    -   a power supply line disposed along a first side on the        substrate;    -   a power supply terminal connected to the power supply line;    -   a first ground line, a second ground line, and a third ground        line disposed on the substrate along a second side that faces        the first side of the substrate;    -   a first ground terminal connected to the first ground line, a        second ground terminal connected to the second ground line, and        a third ground terminal connected to the third ground line;    -   first to third motor terminals connected to coils of the        three-phase motor;    -   first to third half bridges each of which includes a high side        switch and a low side switch connected in series between the        power supply line and a corresponding one of the first to the        third ground lines, a junction point of the high side switch and        the low side switch being connected to a corresponding one of        the first to the third motor terminals, the junction points of        the first to third half bridges being connected in parallel with        one another; and    -   first to sixth control signal terminals, to which control        signals for controlling operations of the high side switches and        the low side switches of the first to the third half bridges are        inputted,    -   wherein the first to the third control signal terminals are        arranged in a direction along which the first side extends in a        manner that one ends of the first to the third control signal        terminals are in the vicinity of the first side of the        substrate, and    -   wherein the fourth to the sixth control signal terminals are        arranged in a direction along which the second side extends in a        manner that one ends of the fourth to the sixth control signal        terminals are in the vicinity of the second side of the        substrate.

In the semiconductor module, the semiconductor module furthercomprising:

-   -   a first control bonding wire connecting a control electrode of a        first high side switch included in the first half bridge and the        first control signal terminal;    -   a second control bonding wire connecting a control electrode of        a second high side switch included in the second half bridge and        the second control signal terminal;    -   a third control bonding wire connecting a control electrode of a        third high side switch included in the third half bridge and the        third control signal terminal;    -   a fourth control bonding wire connecting a control electrode of        a first low side switch included in the first half bridge and        the fourth control signal terminal;    -   a fifth control bonding wire connecting a control electrode of a        second low side switch included in the second half bridge and        the fifth control signal terminal; and    -   a sixth control bonding wire connecting a control electrode of a        third low side switch included in the third half bridge and the        sixth control signal terminal.

In the semiconductor module,

-   -   wherein the fourth control bonding wire extends over the first        ground line,    -   wherein the fifth control bonding wire extends over the second        ground line, and    -   wherein the sixth control bonding wire extends over the third        ground line.

In the semiconductor module,

-   -   wherein the power supply terminal is disposed so as not to cover        the first support dummy line,    -   wherein the third motor terminal is disposed so as not to cover        the second support dummy line,    -   wherein the first ground terminal is disposed so as not to cover        the third support dummy line, and    -   wherein the third ground terminal is disposed so as not to cover        the fourth support dummy line.

In the semiconductor module,

-   -   wherein the first ground line is connected to a second electrode        of the first low side switch via a bonding wire,    -   wherein the second ground line is connected to a second        electrode of the second low side switch via a bonding wire, and    -   wherein the third ground line is connected to a second electrode        of the third low side switch via a bonding wire.

In the semiconductor module, the semiconductor module furthercomprising:

-   -   a first support dummy line disposed on a first corner portion of        the substrate where the first side and the third side intersect        each other;    -   a second support dummy line disposed on a second corner portion        of the substrate where the first side and the fourth side        intersect each other;    -   a third support dummy line disposed on a third corner portion of        the substrate where the second side and the third side intersect        each other; and    -   a fourth support dummy line disposed on a fourth corner portion        of the substrate where the second side and the fourth side        intersect each other,    -   wherein the first to the fourth support dummy lines are pressed        by a support member during a wire bonding process in order to        press the substrate by the support member.

In the semiconductor module, the semiconductor module further comprisinga thermistor disposed between the first ground line and the secondground line or between the second ground line and the third ground lineon the substrate, in the vicinity of the second side of the substrate,to detect a temperature.

In the semiconductor module, wherein an area of each of the first to thethird ground line is smaller than an area of the power supply line.

In the semiconductor module,

-   -   wherein the power supply terminal is disposed so as not to cover        the first support dummy line,    -   wherein the third motor terminal is disposed so as not to cover        the second support dummy line,    -   wherein the first ground terminal is disposed so as not to cover        the third support dummy line, and    -   wherein the third ground terminal is disposed so as not to cover        the fourth support dummy line.

In the semiconductor module,

-   -   wherein the first to the third control signal terminals are        arranged in a direction along which the first side extends so        that one ends of the first to the third control signal terminals        are in the vicinity of the first side of the substrate, and    -   wherein the fourth to the sixth control signal terminals are        arranged in a direction along which the second side extends so        that one ends of the fourth to the sixth control signal        terminals are in the vicinity of the second side of the        substrate.

In the semiconductor module,

-   -   wherein the first control signal terminal is disposed between        the power supply terminal and the first motor terminal,    -   wherein the second control signal terminal is disposed between        the first motor terminal and the second motor terminal, and    -   wherein the third control signal terminal is disposed between        the second motor terminal and the third motor terminal.

In the semiconductor module,

-   -   wherein the fourth control signal terminal is disposed between        the first ground terminal and the second ground terminal, and    -   wherein the fifth and the sixth control signal terminals are        disposed between the second ground terminal and the third ground        terminal.

In the semiconductor module,

-   -   wherein other ends of the first to the third control signal        terminals, which are connected to a mounting substrate, are        disposed to be closer to the first side of the substrate than        another end of the power supply terminal and other ends of the        first to the third motor terminals connected to the mounting        substrate, and    -   wherein other ends of the fourth to the sixth control signal        terminals, which are connected to the mounting substrate, are        disposed to be close to the second side of the substrate than        other ends of the first to the third ground terminals connected        to the mounting substrate.

In the semiconductor module,

-   -   wherein the first half bridge includes a first high side switch        disposed on one end of the power supply line, a first electrode        of the first high side switch being electrically connected to        the power supply line,    -   wherein the third half bridge includes a third high side switch        disposed on another end of the power supply line, a first        electrode of the first high side switch being electrically        connected to the power supply line, and    -   wherein the second half bridge has a second high side switch        disposed on the power supply line between the first high side        switch and the third high side switch, a first electrode of the        second high side switch being electrically connected to the        power supply line.

In the semiconductor module, the semiconductor module furthercomprising:

-   -   a first central wiring line disposed on a top surface of the        substrate between the one end of the power supply line and the        first ground line, and electrically connected to another end of        the first high side switch and the first motor terminal, the        first low side switch being disposed on a top surface of the        first central wiring line;    -   a third central wiring line disposed on the top surface of the        substrate between the other end of the power supply line and the        third ground line, and electrically connected to another end of        the third high side switch and the third motor terminal, the        third low side switch being disposed on a top surface of the        third central wiring line; and    -   a second central wiring line disposed on the top surface of the        substrate between the power supply line and the second ground        line and between the first central wiring line and the third        central wiring line, and electrically connected to another end        of the second high side switch and the second motor terminal,        the second low side switch being disposed on a top surface of        the second central wiring line.

Effects of the Invention

The semiconductor module according to an embodiment in an aspect of thepresent invention is a semiconductor module configured to convert adirect current to a three-phase alternating current, and to supply thethree-phase alternating current to a three-phase motor to drive thethree-phase motor, the semiconductor module comprising: a substrate; apower supply line disposed along a first side on the substrate; a powersupply terminal connected to the power supply line; a first ground line,a second ground line, and a third ground line disposed on the substratealong a second side that faces the first side of the substrate; a firstground terminal connected to the first ground line, a second groundterminal connected to the second ground line, and a third groundterminal connected to the third ground line; first to third motorterminals connected to coils of the three-phase motor; first to thirdhalf bridges each of which includes a high side switch and a low sideswitch connected in series between the power supply line and acorresponding one of the first to the third ground lines, a junctionpoint of the high side switch and the low side switch being connected toa corresponding one of the first to the third motor terminals, thejunction points of the first to third half bridges being connected inparallel with one another; and first to sixth control signal terminals,to which control signals for controlling operations of the high sideswitches and the low side switches of the first to the third halfbridges are inputted.

The first to the third control signal terminals are arranged in adirection along which the first side extends in a manner that one endsof the first to the third control signal terminals are in the vicinityof the first side of the substrate, and the fourth to the sixth controlsignal terminals are arranged in a direction along which the second sideextends in a manner that one ends of the fourth to the sixth controlsignal terminals are in the vicinity of the second side of thesubstrate.

Therefore, in the semiconductor module according to the presentinvention, the signal lines for controlling the switches of the highside and the signal lines for controlling the switches of the low sideare disposed to different locations so that the signal lines forconveying the control signals for controlling the switches may have thesame length and have the same signal transmission time, therebyimproving the switch controllability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating an example of a structure of asemiconductor module 100 according to a first embodiment.

FIG. 2 is a circuit diagram illustrating an example of a circuitconfiguration of the semiconductor module 100 shown in FIG. 1.

FIG. 3 is a diagram illustrating an example of a structure of aconventional semiconductor module.

FIG. 4 is a circuit diagram illustrating an example of a circuitconfiguration of the conventional semiconductor module shown in FIG. 3.

EMBODIMENTS FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will now be described withreference to the accompanying drawings.

First Embodiment

A semiconductor module 100 according to a first embodiment is, forexample, an inverter device for converting a direct current to athree-phase alternating current, which is supplied to a three-phasemotor to drive the three-phase motor.

As shown in FIGS. 1 and 2, for example, the semiconductor module 100includes a substrate B, a power supply line SX, a power supply terminalVin, a first ground line GX1, a second ground line GX2, a third groundline GX3, a first ground terminal GND1, a second ground terminal GND2, athird ground terminal GND3, a first motor terminal P1, a second motorterminal P2, a third motor terminal P3, a first half bridge (Q1, Q4), asecond half bridge (Q2, Q5), a third half bridge (Q3, Q6), first tosixth control signal terminals Q1G to Q6G, first to sixth controlbonding wires BW1 to BW6, a thermistor TM, a first temperature detectionsignal terminal TM1, a second temperature detection signal terminal TM2,a first support dummy line Za, a second support dummy line Zb, a thirdsupport dummy line Zc, a fourth support dummy line Zd, a first centralwiring line MX1, a second central wiring line MX2, a third centralwiring line MX3, and a sealing member K.

The substrate B is an insulated substrate such as a ceramic substrate.

The substrate B has a rectangular shape. The length of a first side B1and the length of a second side B2 that faces the first side B1 is thesame in the substrate B. The length of a third side B3 and the length ofa fourth side B4 that faces the third side B3 are the same in thesubstrate B. The length of the first side B1 is longer than the lengthof the third side B3.

A first direction D1 in which the first side B1 of the substrate Bextends and a second direction D2 in which the third side B3 of thesubstrate B extends are perpendicular to each other.

The power supply line SX is disposed to extend along the first side B1on the substrate B.

The power supply terminal Vin is connected to the power supply line SX.A DC power supply voltage is applied to the power supply terminal Vin.

The first ground line GX1, the second ground line GX2, and the thirdground line GX3 are arranged on the substrate B along the second side B2that faces the first side B1 of the substrate B.

The first ground line GX1 is connected to a second electrode (source) ofa first low side switch Q4 via a bonding wire.

The second ground line GX2 is connected to a second electrode (source)of a second low side switch Q5 via a bonding wire.

The third ground line GX3 is connected to a second electrode (source) ofa third low side switch Q6 via a bonding wire.

The first ground terminal GND1 is connected to the first ground lineGX1, for example, as shown in FIG. 1. The first ground terminal GND1 isgrounded.

One end of the first ground terminal GND1 is connected to one end of thefirst ground line GX1 that is in the vicinity of the third side B3 ofthe substrate B, the third side B3 crossing the first and the secondsides B1 and B2.

The second ground terminal GND2 is connected to the second ground lineGX2, for example, as shown in FIG. 1. The second ground terminal GND2 isgrounded.

One end of the second ground terminal GND2 is connected to one end ofthe second ground line GX2 that is in the vicinity of the second sideB2.

The third ground terminal GND3 is connected to the third ground lineGX3, for example, as shown in FIG. 1. The third ground terminal GND3 isgrounded.

One end of the third ground terminal GND3 is connected to one end of thethird ground line GX3 that is in the vicinity of the fourth side B4facing the third side B3 of the substrate B.

The area of each of the first to the third ground lines GND1, GND2, andGND3 is set to be smaller than the area of the power supply line SX.

The first ground terminal GND1, the second ground terminal GND2, and thethird ground terminal GND3 are arranged along the second side B2 of thesubstrate B as shown in FIG. 1, for example, and electrically insulatedfrom one another (region 10 in FIG. 1).

The first to the third motor terminals P1, P2, and P3 are connected to aU phase coil, a V phase coil, and a W phase coil of a three-phase motor(not shown), respectively.

More specifically, the first motor terminal P1 is connected to a firstphase (U phase) coil of the three-phase motor. The second motor terminalP2 is connected to a second phase (V phase) coil of the three-phasemotor. The third motor terminal P3 is connected to a third phase (Wphase) coil of the three-phase motor.

The first half bridge (Q1, Q4) includes, for example, a first high sideswitch Q1 and a first low side switch Q4, as shown in FIGS. 1 and 2, forexample.

The first high side switch Q1 has one end that is electrically connectedto one end of the power supply terminal Vin, and the other end that isconnected to one end of the first motor terminal P1.

The first low side switch Q4 has one end that is electrically connectedto the one end of the first motor terminal P1, and the other end that iselectrically connected to the first ground line GX1.

As shown in FIG. 1, for example, the first high side switch Q1 of thefirst half bridge (Q1, Q4) is disposed on the one end of the powersupply line SX. The first high side switch Q1 has a first electrode(drain) that is electrically connected to the power supply line SX.

As shown in FIG. 1, for example, a control electrode (gate) of the firsthigh side switch Q1 is electrically connected to the first controlsignal terminal Q1G with the first control bonding wire BW1.

Thus, the first control bonding wire BW1 connects the control electrode(gate) of the first high side switch Q1 included in the first halfbridge (Q1, Q4) and the first control signal terminal Q1G.

The fourth control bonding wire BW4 connects a control electrode (gate)of the first low side switch Q4 included in the first half bridge (Q1,Q4) and the fourth control signal terminal Q4G.

As shown in FIG. 1, for example, the control electrode (gate) of thefirst low side switch Q4 included in the first half bridge (Q1, Q4) iselectrically connected to the fourth control signal terminal Q4G withthe fourth control bonding wire BW4, which is arranged to extend overthe first ground line GX1.

As shown in FIGS. 1 and 2, for example, the second half bridge (Q2, Q5)includes a second high side switch Q2 and a second low side switch Q5.

The second high side switch Q2 has one end that is electricallyconnected between the one end and the other end of the power supplyterminal Vin, and another end that is electrically connected to one endof the second motor terminal P2.

The second low side switch Q5 has one end that is electrically connectedto the one end of the second motor terminal P2, and another end that iselectrically connected to the second ground line GX2.

As shown in FIG. 1 for example, the second high side switch Q2 includedin the second half bridge (Q2, Q5) is disposed on the power supply lineSX between the first high side switch Q1 and the third high side switchQ3. The second high side switch Q2 has a first electrode (drain) that iselectrically connected to the power supply line SX.

As shown in FIG. 1, for example, a control electrode (gate) of thesecond high side switch Q2 and the second control signal terminal Q2Gare electrically connected to each other with the second control bondingwire BW2.

Thus, the second control bonding wire BW2 connects a control electrode(gate) of the second high side switch Q2 included in the second halfbridge (Q2, Q5) and the second control signal terminal Q2G.

The fifth control bonding wire BW5 connects a control electrode (gate)of the second low side switch Q5 included in the second half bridge (Q2,Q5) and the fifth control signal terminal Q5G.

As shown in FIG. 1, for example, the control electrode (gate) of thesecond low side switch Q5 included in the second half bridge (Q2, Q5)and the fifth control signal terminal Q5G are connected to each otherwith the fifth control bonding wire BW5, which extends over the secondground line GX2.

The third half bridge (Q3, Q6) includes a third high side switch Q3 anda third low side switch Q6, as shown in FIGS. 1 and 2, for example.

The third high side switch Q3 has one end that is electrically connectedto the other end of the power supply terminal Vin, and another end thatis electrically connected to one end of the third motor terminal P3.

The third low side switch Q6 has one end that is electrically connectedto the other end of the third motor terminal P3, and another end that iselectrically connected to the third ground line GX3.

As shown in FIG. 1, for example, the third high side switch Q3 of thethird half bridge (Q3, Q6) is disposed on the other end of the powersupply line SX. The third high side switch Q3 has a first electrode(drain) that is electrically connected to the power supply line SX.

As shown in FIG. 1, for example, a control electrode (gate) of the thirdhigh side switch Q3 and the third control signal terminal Q3G areelectrically connected to each other with the third control bonding wireBW3.

Thus, the third control bonding wire BW3 connects the control electrode(gate) of the third low side switch Q3 included in the third half bridge(Q3, Q6) and the third control signal terminal Q3G.

The sixth control bonding wire BW6 connects a control electrode (gate)of the third low side switch Q6 included in the third half bridge (Q3,Q6) and the sixth control signal terminal Q6G.

As shown in FIG. 1, for example, the control electrode (gate) of thethird low side switch Q6 included in the third half bridge (Q3, Q6) andthe sixth control signal terminal Q6G are connected to each other withthe sixth control bonding wire BW6, which extends over the third groundline GX3.

As described above, the first to the third half bridges (Q1, Q4), (Q2,Q5), (Q3, Q6) are configured such that the high side switch Q1 and thelow side switch Q4 are connected in series between the power supply lineSX and the first ground line GX1, the high side switch Q2 and the lowside switch Q5 are connected in series between the power supply line SXand the first ground line GX2, and the high side switch Q3 and the lowside switch Q6 are connected in series between the power supply line SXand the first ground line GX3.

In the first to the third half bridges (Q1, Q4), (Q2, Q5), (Q3, Q6), thejunction point of the high side switch Q1 and the low side switch Q4 isconnected to the first motor terminal P1, the junction point of the highside switch Q2 and the low side switch Q5 is connected to the firstmotor terminal P2, and the junction point of the high side switch Q3 andthe low side switch Q6 is connected to the first motor terminal P3, andthe junctions points are connected in parallel to each other.

As shown in FIG. 1, for example, the first central wiring line MX1 isdisposed on the top surface of the substrate B between the one end ofthe power supply line SX and the first ground line GX1.

The first low side switch Q4 is disposed on the top surface of the firstcentral wiring line MX1. The first central wiring line MX1 iselectrically connected to another end (source) of the first high sideswitch Q1 and the first motor terminal P1.

The third central wiring line MX3 is disposed on the top surface of thesubstrate B between the other end of the power supply line SX and thethird ground line GX3, as shown in FIG. 1, for example.

The third low side switch Q6 is disposed on the top surface of the thirdcentral wiring line MX3. The third central wiring line MX3 iselectrically connected to the other end (source) of the third high sideswitch Q3 and the third motor terminal P3.

The second central wiring line MX2 is disposed on the top surface of thesubstrate B between the power supply line SX and the second ground lineGX2, and between the first central wiring line MX1 and the third centralwiring line MX3, as shown in FIG. 1, for example.

The second low side switch Q5 is disposed on the top surface of thesecond central wiring line MX2. The second central wiring line MX2 iselectrically connected to the other end (source) of the second high sideswitch Q2 and the second motor terminal P2.

Control signals for controlling the operations of the first to the thirdhigh side switches Q1 to Q3 and the first to the third low side switchesQ4 to Q6 of the first to the third half bridges (Q1, Q4), (Q2, Q5), (Q3,Q6) are inputted to the first to the sixth control signal terminals (Q1Gto Q6G), as shown in FIG. 1, for example.

The first to the third control signal terminals Q1G, Q2G, and Q3G arearranged in the direction along which the first side B1 of the substrateB extends with one end of each control signal terminal being in thevicinity of the first side B1.

The first control signal terminal Q1G is disposed between the powersupply terminal Vin and the first motor terminal P1, as shown in FIG. 1,for example.

The second control signal terminal Q2G is disposed between the firstmotor terminal P1 and the second motor terminal P2 as shown in FIG. 1,for example.

The third control signal terminal Q3G is disposed between the secondmotor terminal P2 and the third motor terminal P3, as shown in FIG. 1,for example.

The fourth to the sixth control signal terminals Q4, Q5, and Q6 arearranged in the direction along which the second side B2 of thesubstrate B extends with one end of each control signal terminal beingin the vicinity of the second side B2.

As a result, the signal lines for controlling the switches of the highside and the signal lines for controlling the switches of the low sideare disposed to different locations (regions 10 in FIG. 1) so that thesignal lines for conveying the control signals for controlling theswitches may have the same length and have the same signal transmissiontime, thereby improving the switch controllability.

The fourth control signal terminal Q4G is disposed between the firstground terminal GND1 and the second ground terminal GND2, as shown inFIG. 1, for example.

The fifth and the sixth control signal terminals Q5G and Q6G aredisposed between the second ground terminal GND2 and the third groundterminal GND3, as shown in FIG. 1, for example.

The thermistor TM is disposed near the second side B2 on the substrate Bbetween the first ground line GX1 and the second ground line GX2, orbetween the second ground line GX2 and the third ground line GX3. Thethermistor TM is for detecting the ambient temperature.

In the example shown in FIG. 1, the thermistor TM is disposed in thevicinity of the second side B2 of the substrate B between the secondground line GX2 and the third ground line GX3.

The first temperature detection signal terminal TM1 is electricallyconnected to one end of the thermistor TM, as shown in FIG. 1 forexample.

The second temperature detection signal terminal TM2 is electricallyconnected to the other end of the thermistor TM, as shown in FIG. 1 forexample.

The first and the second temperature detection signal terminals TM1 andTM2 are disposed between the fifth control signal terminal Q5G and thesixth control signal terminal Q6G, as shown in FIG. 1 for example.

In the example of FIG. 1, the thermistor TH is disposed between thesecond ground line GX2 and the third ground line GX3. However, ifnecessary, the thermistor TH may be disposed in the vicinity of thepower supply line SX on the high side where the temperature may changeeasily.

The first support dummy line Za is disposed on a first corner portion ofthe substrate B where first side B1 and the third side B3 of thesubstrate B intersect each other, as shown in FIG. 1 for example.

The power supply terminal Vin described above is disposed so as not tocover the first support dummy line Za, as shown in FIG. 1 for example.

As shown in FIG. 1, for example, the second support dummy line Zb isdisposed on a second corner portion of the substrate B where the firstside B1 and the fourth side B4 of the substrate B intersect each other.

The third motor terminal P3 described above is disposed so as not tocover the second support dummy line Zb as shown in FIG. 1 for example.

The third support dummy line Zc is disposed on a third corner portion ofthe substrate B where the second side B2 and the third side B3 of thesubstrate B intersect each other, as shown in FIG. 1 for example.

The first ground terminal GND1 described above is disposed so as not tocover the third support dummy line Zc as shown in FIG. 1 for example.

The fourth support dummy line Zd is disposed on a fourth corner portionof the substrate B where the second side B2 and the fourth side B4 ofthe substrate B intersect each other.

The third ground terminal GND3 described above is disposed so as not tocover the fourth support dummy line Zd as shown in FIG. 1 for example.

The top surfaces of the first to the fourth support dummy lines Za to Zdare pressed by a support member (not shown) during a wire bondingprocess so that the substrate B is pressed by the support member.

The first to the fourth support dummy lines Za to Zd are formed with thesame material as the power supply line SX etc. described above.

The other ends of the first to the third control signal terminals Q1G toQ3G connected to a mounting substrate (not shown) are disposed to becloser to the first side B1 of the substrate B than the other end of thepower supply terminal Vin and the other ends of the first to the thirdmotor terminals P1 to P3 connected to the mounting substrate.

The other ends of the fourth to the sixth control signal terminals Q4Gto Q6G connected to the mounting substrate are disposed to be closer tothe second side B2 of the substrate B than the other ends of the firstto the third ground terminals PGND1 to GND3 connected to the mountingsubstrate.

As a result, when the electronic module 100 is disposed in the vicinityof a CPU mounted on the mounting substrate, the other ends of the firstto the third control signal terminals Q1G to Q3G and the fourth to thesixth control signal terminals Q4G to Q6G may be connected to themounting substrate so as to be close to the CPU. Therefore, the lengthsof the wiring lines from the CPU to the other ends of the first to thethird control signal terminals Q1G to Q3G and to the other ends of thefourth to the sixth control signal terminals Q4G to Q6G may beshortened.

Furthermore, the other end of the power supply terminal Vin, the otherends of the first to the third motor terminals P1 to P3, and the otherends of the first to the third ground terminals PGND1 to GND3, throughwhich a large current may flow, may be disposed to be at a distance fromthe CPU.

The sealing member K is formed of a sealing resin such as an epoxyresin. In FIG. 1, the sealing member K is illustrated to be transparent.

As shown in FIG. 1, for example, the sealing member K seals, at least onthe substrate B, the power supply line SX, the power supply terminalVin, the first ground line GX1, the second ground line GX2, the thirdground line GX3, first to third output lines LMU, LMV, and LMW, thefirst to the third central wiring lines LYU, LYV, and LYW, a firstcurrent detection wiring line LC1, a second current detection wiringline LC2, a connection wiring line LR1, a first thermistor wiring lineLT1, a second thermistor wiring line LT2, a first capacitor C1, a secondcapacitor C2, a resistor R1, the first half bridge (01, Q4), the secondhalf bridge (Q2, Q5), the third half bridge (Q3, Q6), the thermistor TM,the first support dummy line Za, the second support dummy line Zb, thethird support dummy line Zc, the fourth support dummy line Zd, the firstcentral wiring line MX1, the second central wiring line MX2, the thirdcentral wiring line MX3, the first to the sixth control bonding wiresBW1 to BW6, and other bonding wires.

Furthermore, the sealing member K seals the one ends of the power supplyterminal Vin, the first motor terminal P1, the second motor terminal P2,the third motor terminal P3, the first control signal terminal Q1G, thesecond control signal terminal Q2G, and the third control signalterminal Q3G along the first side B1 of the substrate B, as shown inFIG. 1, for example.

The sealing member K further seals the one ends of the first groundterminal GND1, the second ground terminal GND2, the third groundterminal GND3, the first temperature detection signal terminal TM1, thesecond temperature detection signal terminal TM2, the fourth controlsignal terminal Q4G, the fifth control signal terminal Q5G, and thesixth control signal terminal Q6G along the second side B2 of thesubstrate B, as shown in FIG. 1, for example.

As described above, the first ground line GX1, the second ground lineGX2, and the third ground line GX3 of the semiconductor module 100 aredisposed along the second side B2 that faces the first side B1 of thesubstrate B as shown in FIG. 1. The first ground terminal GND1 isconnected to the first ground line GX1, the second ground terminal GND2is connected to the second ground line GX2, and the third groundterminal GND3 is connected to the third ground line GX3. The firstground terminal GND1, the second ground terminal GND2, and the thirdground terminal GND3 are arranged along the second side B2 to beseparated from one another and electrically isolated from one another.

Since the first to the third ground terminals GND1, GND2, and GND3,which are lead terminals, do not extend over the first to the thirdground lines GX1, GX2, and GX3, the influence among the wiring linessuch as the inductance may be reduced, thereby reducing the noise.

Therefore, in the semiconductor module 100 according to the firstembodiment, the inductance of each ground line may be reduced, and theswitching noise of the switches of the half bridges included in thesemiconductor module may be reduced.

Since the first to the third ground terminals GND1, GND2, and GND3,which are lead terminals, do not extend over the first to third groundlines GX1, GX2, and GX3, the influence among the wiring lines such asthe inductance may be reduced, thereby reducing the noise.

Furthermore, as described above, the first to the third control signalterminals Q1G, Q2G, and Q3G are arranged in the direction along whichthe first side B1 of the substrate B extends so that the one endsthereof are in the vicinity of the first side B1, and the fourth to thesixth control signal terminals Q4, Q5, and Q6 are arranged in thedirection along which the second side B2 of the substrate B so that theone ends thereof are in the vicinity of the second side B2.

Therefore, in the semiconductor module 100 according to the firstembodiment 1, the signal lines for controlling the switches of the highside and the signal lines for controlling the switches of the low sideare disposed to different locations so that the signal lines forconveying the control signals for controlling the switches may have thesame length and have the same signal transmission time, therebyimproving the switch controllability.

Second Embodiment

In the first embodiment described above, the first to the third highside switches Q1, Q2, and Q3 and the first to the third low sideswitches Q4, Q5, and Q6 are nMOSFETs (FIG. 2). However, othersemiconductor devices may be used.

In other words, the first to the third high side switches Q1, Q2, and Q3and the first to the third low side switches Q4, Q5, and Q6 may bepMOSFETs or other semiconductor devices as long as the same functionsare achieved.

The configuration of the semiconductor module according to the secondembodiment is the same as that of the first embodiment except for theabove point.

As described above, the semiconductor module 100 according to an aspectof the present invention includes the substrate B, the power supply lineSX disposed along the first side B1 of the substrate, the power supplyterminal Vin connected to the power supply line, the first ground lineGX1, the second ground line GX2, and the third ground line GX3 disposedon the substrate along the second side B2 facing the first side B1 ofthe substrate, the first ground terminal GND1 connected to the firstground line GX1, the second ground terminal GND2 connected to the secondground line GX2, the third ground terminal GND3 connected to the thirdground line GX3, the first to the third motor terminals (P1, P2, P3)connected to the coils of the three-phase motor, the first to the thirdhalf bridges (Q1, Q4), (Q2, Q5), (Q3, Q6), in each of which the highside switch and the low side switch are connected in series between thepower supply line and the corresponding one of the first to the thirdground lines, and the junction point of the high side switch and the lowside switch is connected to the corresponding one of the first to thethird motor terminals, the junction points being connected in parallelto one another, and the first to the sixth control signal terminals(Q1G, Q2G, Q3G, Q4G, Q5G, Q6G) to which control signals for controllingthe operations of the high side switches and the low side switches ofthe first to the third half bridges are inputted.

The first to the third control signal terminals Q1G, Q2G, and Q3G arearranged in the direction along which the first side B1 extends so thatthe one ends thereof are in the vicinity of the first side B1 of thesubstrate B, and the fourth to the sixth control signal terminals Q4,Q5, and Q6 are arranged in the direction along which the second side B2extends so that the one ends thereof are in the vicinity of the secondside B2 of the substrate B.

Therefore, in the semiconductor module according to the presentinvention, the signal lines for controlling the switches of the highside and the signal lines for controlling the switches of the low sideare disposed to different locations so that the signal lines forconveying the control signals for controlling the switches may have thesame length and have the same signal transmission time, therebyimproving the switch controllability.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. The embodiments may be embodied in a variety ofother forms. Furthermore, various omissions, substitutions and changesin the form of the methods and systems described herein may be madewithout departing from the spirit of the inventions. The embodiments andtheir modifications are included in the scope and the subject matter ofthe invention, and at the same time included in the scope of the claimedinventions and their equivalents.

EXPLANATION OF REFERENCES

100: semiconductor module

B: substrate

SX: power supply line

Vin: power supply terminal

GX1: first ground line

GX2: second ground line

GX3: third ground line

GND1: first ground terminal

GND2: second ground terminal

GND3: third ground terminal

P1: first motor terminal

P2: second motor terminal

P3: third motor terminal

Q1G: first control signal terminal

Q2G: second control signal terminal

Q3G: third control signal terminal

Q4G: fourth control signal terminal

Q5G: fifth control signal terminal

Q6G: sixth control signal terminal

BW1: first control bonding wire

BW2: second control bonding wire

BW3: third control bonding wire

BW4: fourth control bonding wire

BW5: fifth control bonding wire

BW6: sixth control bonding wire

TM: thermistor

TM1: first temperature detection signal terminal

TM2: second temperature detection signal terminal

Za: first support dummy line

Zb: second support dummy line

Zc: third support dummy line

Zd: fourth support dummy line

MX1: first central wiring line

MX2: second central wiring line

MX3: third central wiring line

K: sealing member

Q1: first high side switch

Q2: second high side switch

Q3: third high side switch

Q4: first low side switch

Q5: second low side switch

Q6: third low side switch

1. A semiconductor module configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, the semiconductor module comprising: a substrate; a power supply line disposed along a first side on the substrate; a power supply terminal connected to the power supply line; a first ground line, a second ground line, and a third ground line disposed on the substrate along a second side that faces the first side of the substrate; a first ground terminal connected to the first ground line, a second ground terminal connected to the second ground line, and a third ground terminal connected to the third ground line; first to third motor terminals connected to coils of the three-phase motor; first to third half bridges each of which includes a high side switch and a low side switch connected in series between the power supply line and a corresponding one of the first to the third ground lines, a junction point of the high side switch and the low side switch being connected to a corresponding one of the first to the third motor terminals, the junction points of the first to third half bridges being connected in parallel with one another; and first to sixth control signal terminals, to which control signals for controlling operations of the high side switches and the low side switches of the first to the third half bridges are inputted, wherein the first to the third control signal terminals are arranged in a direction along which the first side extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side of the substrate, and wherein the fourth to the sixth control signal terminals are arranged in a direction along which the second side extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side of the substrate.
 2. The semiconductor module according to claim 1, further comprising: a first control bonding wire connecting a control electrode of a first high side switch included in the first half bridge and the first control signal terminal; a second control bonding wire connecting a control electrode of a second high side switch included in the second half bridge and the second control signal terminal; a third control bonding wire connecting a control electrode of a third high side switch included in the third half bridge and the third control signal terminal; a fourth control bonding wire connecting a control electrode of a first low side switch included in the first half bridge and the fourth control signal terminal; a fifth control bonding wire connecting a control electrode of a second low side switch included in the second half bridge and the fifth control signal terminal; and a sixth control bonding wire connecting a control electrode of a third low side switch included in the third half bridge and the sixth control signal terminal.
 3. The semiconductor module according to claim 2, wherein the fourth control bonding wire extends over the first ground line, wherein the fifth control bonding wire extends over the second ground line, and wherein the sixth control bonding wire extends over the third ground line.
 4. The semiconductor module according to claim 2, wherein the power supply terminal is disposed so as not to cover the first support dummy line, wherein the third motor terminal is disposed so as not to cover the second support dummy line, wherein the first ground terminal is disposed so as not to cover the third support dummy line, and wherein the third ground terminal is disposed so as not to cover the fourth support dummy line.
 5. The semiconductor module according to claim 4, wherein the first ground line is connected to a second electrode of the first low side switch via a bonding wire, wherein the second ground line is connected to a second electrode of the second low side switch via a bonding wire, and wherein the third ground line is connected to a second electrode of the third low side switch via a bonding wire.
 6. The semiconductor module according to claim 4, further comprising: a first support dummy line disposed on a first corner portion of the substrate where the first side and the third side intersect each other; a second support dummy line disposed on a second corner portion of the substrate where the first side and the fourth side intersect each other; a third support dummy line disposed on a third corner portion of the substrate where the second side and the third side intersect each other; and a fourth support dummy line disposed on a fourth corner portion of the substrate where the second side and the fourth side intersect each other, wherein the first to the fourth support dummy lines are pressed by a support member during a wire bonding process in order to press the substrate by the support member.
 7. The semiconductor module according to claim 1, further comprising a thermistor disposed between the first ground line and the second ground line or between the second ground line and the third ground line on the substrate, in the vicinity of the second side of the substrate, to detect a temperature.
 8. The semiconductor module according to claim 1, wherein an area of each of the first to the third ground line is smaller than an area of the power supply line.
 9. The semiconductor module according to claim 8, wherein the power supply terminal is disposed so as not to cover the first support dummy line, wherein the third motor terminal is disposed so as not to cover the second support dummy line, wherein the first ground terminal is disposed so as not to cover the third support dummy line, and wherein the third ground terminal is disposed so as not to cover the fourth support dummy line.
 10. The semiconductor module according to claim 1, wherein the first to the third control signal terminals are arranged in a direction along which the first side extends so that one ends of the first to the third control signal terminals are in the vicinity of the first side of the substrate, and wherein the fourth to the sixth control signal terminals are arranged in a direction along which the second side extends so that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side of the substrate.
 11. The semiconductor module according to claim 10, wherein the first control signal terminal is disposed between the power supply terminal and the first motor terminal, wherein the second control signal terminal is disposed between the first motor terminal and the second motor terminal, and wherein the third control signal terminal is disposed between the second motor terminal and the third motor terminal.
 12. The semiconductor module according to claim 11, wherein the fourth control signal terminal is disposed between the first ground terminal and the second ground terminal, and wherein the fifth and the sixth control signal terminals are disposed between the second ground terminal and the third ground terminal.
 13. The semiconductor module according to claim 12, wherein other ends of the first to the third control signal terminals, which are connected to a mounting substrate, are disposed to be closer to the first side of the substrate than another end of the power supply terminal and other ends of the first to the third motor terminals connected to the mounting substrate, and wherein other ends of the fourth to the sixth control signal terminals, which are connected to the mounting substrate, are disposed to be close to the second side of the substrate than other ends of the first to the third ground terminals connected to the mounting substrate.
 14. The semiconductor module according to claim 1, wherein the first half bridge includes a first high side switch disposed on one end of the power supply line, a first electrode of the first high side switch being electrically connected to the power supply line, wherein the third half bridge includes a third high side switch disposed on another end of the power supply line, a first electrode of the first high side switch being electrically connected to the power supply line, and wherein the second half bridge has a second high side switch disposed on the power supply line between the first high side switch and the third high side switch, a first electrode of the second high side switch being electrically connected to the power supply line.
 15. The semiconductor module according to claim 14, further comprising: a first central wiring line disposed on a top surface of the substrate between the one end of the power supply line and the first ground line, and electrically connected to another end of the first high side switch and the first motor terminal, the first low side switch being disposed on a top surface of the first central wiring line; a third central wiring line disposed on the top surface of the substrate between the other end of the power supply line and the third ground line, and electrically connected to another end of the third high side switch and the third motor terminal, the third low side switch being disposed on a top surface of the third central wiring line; and a second central wiring line disposed on the top surface of the substrate between the power supply line and the second ground line and between the first central wiring line and the third central wiring line, and electrically connected to another end of the second high side switch and the second motor terminal, the second low side switch being disposed on a top surface of the second central wiring line. 